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    • BOE MLED COB

      Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

      • BOE MLED COB

      • BOE MLED COB

      • BOE MLED COB

    • Product Highlights

    • Cases

    • Product Parameters

    • Contact us

    Product Highlights

    • RGB full flip

      Reduce cost and improve quality

    • Thin Package

      Thinner<250um

    • Black film package

      Continue to improve picture quality

    • Common cathode drive

      Better experience closer to the screen

    • High protection and high reliability

      Reduce transport and maintenance risks

    • Power/Dual-Link solution

      Major projects are guaranteed

    • Overseas qualification

      Products are available for sale overseas

    • Curved splicing

      Enable multiple scenarios

    Product Parameters

    BYH-COB
    Specifications BYH007G BYH-B009A0 BYH-B012A0 BYH-B012A2/A3 BYH-B015A1 BYH009H BYH012H BYH015H BYH019H
    Pitch 0.78 0.9375 1.25 1.25 1.5625 0.9525 1.27 1.5875 1.905
    Module Resolution（mm） 300*337.5 300*337.5 300*337.5 150*168.75 150*168.75 304.8*342.9 304.8*342.9 304.8*342.9 304.8*342.9
    Module Size（mm） 600*337.5 600*337.5 600*337.5 600*337.5 600*337.5 609.6*342.9 609.6*342.9 609.6*342.9 609.6*342.9
    Maintenance Mode Front
    Cabinet Material Die-Cast Aluminum
    Typical Life Value（hrs） ≥100，000
    Color Gamut NTSC 110%
    Brightness（nit） ≥600 ≥1000 ≥800 ≥800 ≥800 ≥700 ≥700 ≥700 ≥700
    Refresh Rate（Hz） 3840
    Max. Power Consumption（W/m2） 470 320 310 320 230 480 480 480 480

    * Please click on the bottom of the project for more product details.

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